Top quality starts with the smallest details – that’s why we rely on state-of-the-art 3D SPI (Solder Paste Inspection) technology.
This process checks the
solder paste print for volume, offset, area, height, and bridging to detect and
eliminate errors at an early stage. This ensures that only perfectly prepared PCBs
enter the assembly process.
Thanks to continuous process monitoring, we can intervene immediately before
deviations occur – ensuring a consistently high First Pass Yield (FPY). In addition,
our traceability report provides maximum transparency and documents every
PCB in detail.
The benefits at a glance:
- Error minimization: No defective solder paste printing enters production
- Maximum transparency: Complete traceability through individual reports
- Reliable quality: Early error detection for optimal production
- Connected processes: Data transfer to downstream inspection procedures Trust in advanced technology to ensure safe, efficient, and error-free manufacturing.
Rely on the most modern technologies for a safe, efficient and error-free production.