SMT-Assembly

Precise Placement. Maximum Performance.

In the field of Surface-Mount Technology (SMT), we use the latest machines, continuously improved through long-standing partnerships with leading equipment suppliers. This close collaboration allows us to implement advanced processes and technologies. For solder paste application, in addition to conventional stencil printing, we also utilize the latest jet printing technology.

Solder Paste Printing – Jet Printing Technology

Jet printing technology enables precise, contactless application of solder paste and SMD adhesive—completely without stencils. This guarantees exact dosing and the highest quality standards (IPC-Class 3), even for the smallest structures. By flexibly adjusting the solder paste volume for each pad and using different paste grain sizes on a single PCB, we can efficiently and quickly respond to various component types. The sealed paste unit protects against contamination and moisture, while traceability reports for each PCB ensure complete tracking.

Your Benefits:

  • Individual solder paste dosing
  • Maximum flexibility without stencils
  • Highest precision for fine structures
  • Protection against contamination and moisture
  • Full traceability

With this technology, we offer you efficient and high-quality production that flexibly adapts to your requirements.

Pick&Place

Our Pick & Place process ensures reliable handling of a wide variety of component types. Optimized material handling and short setup times enable time-efficient and precise production—even for the smallest batch sizes or initial samples. Each component is assigned a unique identification number that documents its entire lifecycle—from storage through placement to assembly. This traceability provides transparency and security throughout production. Our innovative feeder technology reduces material waste and minimizes lead times. All components are measured both geometrically and electrically to eliminate errors caused by incorrect labeling.

Your Benefits:

  • Handling of diverse package types
  • Full traceability
  • Reduced material waste through optimized feeding
  • Precise electrical and geometric measurement
  • Efficient production of all batch sizes

Our commitment: Highest reliability and precision in every production step.

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